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LM3209TLE-G3&NOPB

Power management

    Texas InstrumentsBrandedLM3209TLE-G3&NOPBIntegrated circuit electronic chips use250Encapsulated, with a working temperature range of-30°C ~ 85°C（TA）,The voltage is,use12-WFBGA，DSBGAPackaging technology，nowLM3209TLE-G3&NOPBChip inventory is11369individual。
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Power management

LM3209TLE-G3&NOPB
查看电源型号为LM3209TLE-G3&NOPB，品牌为TI的大图  
 
LM3209TLE-G3&NOPB     There is sufficient supply and supply is ongoing...
Chip Information    
Model   LM3209TLE-G3&NOPB
Brand  
Manufacturer   Texas Instruments
PDF   Viewing PDF files
Inventory quantity   11369
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Characteristic    
Minqty   250
Series   IC REG BCK BST ADJ 650MA 12DSBGA
Packaging and Encapsulation   12-WFBGA，DSBGA
Operation Temperature   -30°C ~ 85°C（TA）
Describe  
 
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