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MC33HB2000ES

Power management

    NXP USA Inc.BrandedMC33HB2000ESIntegrated circuit electronic chips use260Encapsulated, with a working temperature range of-40°C ~ 125°C（TJ）,The voltage is3.3V ~ 5V,use28-VQFN 裸露焊盘Packaging technology，nowMC33HB2000ESChip inventory is16998individual。
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Power management

MC33HB2000ES
查看电源型号为MC33HB2000ES，品牌为NXP的大图  
 
MC33HB2000ES     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MC33HB2000ES
Brand   NXP
Manufacturer   NXP USA Inc.
PDF   Viewing PDF files
Inventory quantity   16998
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Characteristic    
Minqty   260
Series   H-BRIDGE SPI BRUSHED DC MOTOR
Packaging and Encapsulation   28-VQFN 裸露焊盘
Supply Voltage   3.3V ~ 5V
Operation Temperature   -40°C ~ 125°C（TJ）
Describe  
 
DC 电机，通用
 
 
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