BUK1M200-50SDLD,51
Power management
NXP USA Inc.BrandedBUK1M200-50SDLD,51Integrated circuit electronic chips use1Encapsulated, with a working temperature range of150°C(TJ),The voltage is不需要,use20-SOIC(0.295",7.50mm 宽)Packaging technology,nowBUK1M200-50SDLD,51Chip inventory is19808individual。
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