Image


MC33XS2410EL

Power management

    NXP USA Inc.BrandedMC33XS2410ELIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of-40°C ~ 150°C(TJ),The voltage is不需要,use28-SOIC(0.173",4.40mm 宽)裸露焊盘Packaging technology,nowMC33XS2410ELChip inventory is14136individual。
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Power management

MC33XS2410EL

查看电源型号为MC33XS2410EL,品牌为NXP的大图  
 
MC33XS2410EL     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MC33XS2410EL
Brand   NXP
Manufacturer   NXP USA Inc.
PDF   Viewing PDF files
Inventory quantity   14136
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Characteristic    
Minqty   1
Series   HIGH-SIDE SWITCH 60V HTSSOP28
Packaging and Encapsulation   28-SOIC(0.173",4.40mm 宽)裸露焊盘
Supply Voltage   不需要
Operation Temperature   -40°C ~ 150°C(TJ)
Describe  
 
 
 
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