MC33PF8200DBES
Power management
NXP USA Inc.BrandedMC33PF8200DBESIntegrated circuit electronic chips use260Encapsulated, with a working temperature range of-40°C ~ 105°C(TA),The voltage is2.5V ~ 5.5V,use56-VFQFN 裸露焊盘Packaging technology,nowMC33PF8200DBESChip inventory is10740individual。
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