Image


MC33FS6504LAE

Power management

    NXP USA Inc.BrandedMC33FS6504LAEIntegrated circuit electronic chips use250Encapsulated, with a working temperature range of-40°C ~ 125°C,The voltage is1V ~ 5V,use48-LQFP 裸露焊盘Packaging technology，nowMC33FS6504LAEChip inventory is19287individual。
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Power management

MC33FS6504LAE
查看电源型号为MC33FS6504LAE，品牌为NXP的大图  
 
MC33FS6504LAE     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MC33FS6504LAE
Brand   NXP
Manufacturer   NXP USA Inc.
PDF   Viewing PDF files
Inventory quantity   19287
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Characteristic    
Minqty   250
Series   SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging and Encapsulation   48-LQFP 裸露焊盘
Supply Voltage   1V ~ 5V
Operation Temperature   -40°C ~ 125°C
Describe  
 
系统基础芯片
 
 
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